Soldering Paste Solder Flux Lead-free Easy to Soldering for Soldering SMD BGA IC PCB LED Soldering Repair Welding Components – KSH 500 at HIMASTORES Mombasa – best electronics in Kenya
Home / HIMA electronics / Soldering Paste Solder Flux Lead-free Easy to Soldering for Soldering SMD BGA IC PCB LED Soldering Repair Welding Components

Soldering Paste Solder Flux Lead-free Easy to Soldering for Soldering SMD BGA IC PCB LED Soldering Repair Welding Components

SKU: HMJ595 Category: HIMA electronics
KSH 500.00
Out of Stock

Product Description

Lead-Free Soldering Paste Flux for SMD & BGA Repair

Professional-Grade Soldering Assistant for Precision Work

This is a lead-free soldering paste flux designed for easy soldering of SMD, BGA, IC, PCB, and LED components. The flux improves wetting and prevents oxidation during repair and assembly work.

HighActivity Flux Cleans and prepares surfaces for perfect joints
LeadFree Formula RoHS compliant for modern electronics
Store in refrigerator at 2°C to 8°C for maximum shelf life
Apply small amount with syringe tip for precise placement
Keep away from eyes and skin - contains mildly acidic activators

Technical Specifications

ParameterValue
Flux TypeRMA (Rosin Mildly Activated)
CompositionLead-free alloy + flux medium
Working Temperature180°C to 220°C
Shelf Life12 months (refrigerated)
Residue TypeClear, non-conductive
Cleaning RequiredYes (IPA recommended)
Halogen ContentHalogen-free formula
Activity LevelMedium activation

= Key Features =

Easy Application - Syringe or brush dispensing

Excellent Wetting - Flows smoothly on pads and leads

Low Residue Clear, easyto-clean flux residue

Prevents Bridging - Controlled surface tension

Suitable for All SMD - Works on 0201 to large BGAs

= Applications =

  1. Smartphone and tablet board repair
  2. Laptop motherboard rework
  3. LED strip and module soldering
  4. Prototype PCB assembly
  5. BGA reballing and replacement
  6. Fine-pitch IC installation
Professional Choice - Used by repair technicians worldwide
Versatile Formula - Works on copper, gold, and tin surfaces

√ Ready to use straight from container

√ Compatible with hot air, soldering iron, and reflow ovens

√ No harmful lead content

Usage Instructions

Application steps:

  1. Stir paste thoroughly before use (if settled)
  2. Apply small amount to pads or component leads
  3. Place component accurately
  4. Heat to 180°C minimum until paste flows
  5. Allow cooling naturally
  6. Clean residue with IPA
Best results with preheating PCB to 100°C first
For BGA, use stencil for consistent paste deposition

Storage & Handling

Refrigeration Required - Extends shelf life significantly

Tightly Seal Container - Prevents flux evaporation

Bring to Room Temperature Allow 12 hours before use

Avoid Contamination - Use clean tools each time

Never freeze the paste - separates flux from alloy
Do not use paste if it appears dried or separated
Operate in ventilated area with fume extraction

Troubleshooting

Poor wetting:

  • Increase temperature to 200°C
  • Clean PCB surface with IPA first
  • Avoid using oxidized solder pads

Excessive splattering:

  • Reduce heating speed
  • Remove moisture from paste
  • Avoid overheating above 240°C
99% customer satisfaction rating
Technical datasheet downloadable

Ordering Information

Package SizeTypeTemperatureStock
10g SyringeLead-free180-220°CIn Stock
50g JarLead-free180-220°CIn Stock
100g JarLead-free180-220°CAvailable

Bulk Discounts on professional quantities

Refrigerated Shipping for fresh product

√ 100% quality inspected

√ Includes MSDS documentation

√ ISO 9001 certified manufacturing

SMDBGALead-Free
FluxRepairBest Quality